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Extra info for Advances in Joining of Ceramics, Volume 138
Sci;, 35: 2913 - 2925,2000. 75. M. Gopal, L. C. DeJonghe and G. Thomas, "Silicon nitride: from sintering to joining", Acta Mater, 46: 2401 - 2405,1998. 76. A. Bhatnagar, M. J. Hoffman and R. H. Dauskardt, "Fracture and subcritical crack growth behavior of Y-Si-Al-O-N glasses and Si3N4 ceramics", J. Am. Ceram. Soc, 83: 585 -596, 2000. 77. K. H. Sandhage, H. J. Schmutzler, R. Wheeler and H. L Fraser, "Mullite Joining by Oxidation of Malleable, Alkaline-Earth-Bearing Bonding Agents", J. Am. Ceram.
57 Advances in Joining of Ceramics 38 CONCLUSIONS In graded joint design it is clear that one must account for both applied and residual stresses, and that very different failure modes obtain for joints with different toughness. Furthermore, the stress fields present in the absence of cracks, as one might obtain by finite element analysis, may not reveal the type of failure expected when flaws are present in the interlayers. The current work has shown that the type of failure within a graded joint may depend strongly on the architectural parameters and the toughness of the interlayer containing the critical flaw.
31 Advances in Joining of Ceramics lap method 5 \ This S-L curve is for Cu/Ni In general, as the surface roughness is not uniform, the void spacing 2L changes with increasing the bondratio S = X/L. In particular, the surface roughness is different between Cu and Ni (dissimilar materials). The change in half the effective void spacing L with S was estimated by the overlap methods proposed elsewhere 5 \ Fig. 2 shows the change in L with S (S-L curve) for the Cu/Ni bonding. The value of L is averaged in each stage 5.
Advances in Joining of Ceramics, Volume 138